Nvidia CEO Reveals Shift in Advanced Packaging Needs Amid Strong Demand
2025-01-16
MSN
Nvidia's CEO Jensen Huang has confirmed that the company's demand for advanced packaging technology from TSMC remains robust, despite a shift in the type of technology required. This update comes after speculation about potential order cuts, with Huang highlighting the evolving needs of the US AI chip giant. As the company continues to drive innovation in artificial intelligence and machine learning, its demand for cutting-edge packaging solutions persists, with a focus on tailored technologies to support its growing ambitions in the AI and semiconductor markets. Key areas of focus include advanced packaging and semiconductor manufacturing.
